Advanced Packaging, IEEE Transactions

Description: 

Cynde Reid Gustafson wrote:
From: "Cynde Reid Gustafson" <nj@ccat.sas.upenn.edu>
Subject: Advanced Packaging, IEEE Transactions
Date: Sun, 26 Aug 2001 22:30:56 -0400

Advanced Packaging, IEEE Transactions

http://ieeexplore.ieee.org/lpdocs/epic03/RecentIssues.htm?punumber=6040
(Link inactive 2 April 2004)

http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?puNumber=6040
(Link active 2 April 2004)

The Transactions solicits original manuscripts in the following areas:
- Thick-and thin-film packages
- Production processes applicable to advanced packages
- Interconnections: electronic, photonic
- 2D and 3D high-density implementations
- Package reliability, with and without hermeticity
- Lowcost COB implementations
- Ball-Grid Array, MCM packaging
- Miniature and chip-size packages LED and LCD panel arrays
- Commercial and military applications and environments
- Power hybrids Mixed technology modules
- Testing strategies and techniques
- Computer-aided Design issues for package modeling, design
- Subsystem level designrule checking and simulation
- Education: MCM/Packaging curriculum development
- Power distribution in packages Specific implementation of thermal
management to advanced packages
- Specific implementation of mechanical design to an advanced package
- Electrical design and modelling, with experimental verification
- Product and functional views Applications: subsystems, clusters,
interconnectivity, partition
- Basic properties of packaging designs and structures
- Low frequency, cost effective pkgs
- Microwave packages
- Optical approaches to packaging

Subscribers have access to full-text articles.

Editor: Prof. Peter Krusius
Email: krusius@iscatr.ee.cornell.edu

Original posting date: 
Thursday, October 11, 2001
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